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Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
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Peter Wappler - Wissenschaftlicher Mitarbeiter - Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | XING
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
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JMMP | Free Full-Text | An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages
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Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile
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JMMP | Free Full-Text | Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding
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Peter WAPPLER | PhD | Master of Science | Institute for Micro Assembly Technology of the Hahn-Schickard-Gesellschaft e.V., Stuttgart | HSG-IMAT | Precision- and Polymertechnologies | Research profile
Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding - Document - Gale Academic OneFile
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